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precision multilayer ISP motherboard
1、manufacturing will be lower than the traditional complex pressing process.
2, increase the line density: the interconnection of traditional circuit board and parts
3, conducive to the use of advanced construction technology
4. Better electrical perfo
Parameters
Product parameters:
name of product: precision multiyaler ISP motherboard
number of board : 6 layer
Material: FR-4
Finished product thickness: 1.6MM
Finished copper thickness: 35UM
Surface treatment: immersion gold
Minimum aperture: 0.2mm
Minimum line width: 0.116mm/0.119mm
Detail diagram：
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Product Detail
1、manufacturing will be lower than the traditional complex pressing process.
2, increase the line density: the interconnection of traditional circuit board and parts
3, conducive to the use of advanced construction technology
4. Better electrical performance and signal correctness
5. Heat properties can be improved
6. Improve rf interference/electromagnetic interference/electrostatic release (RFI/EMI/ESD)
7. Increase the efficiency of design
please call me ,if you have anything need
amy: 15696407315
wechat:S13662633346
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