Pcb layer setting and power ground segmentation requirements

1. Vertical wiring rules must be defined when the two signal layers are directly adjacent.

2. The main power layer is adjacent to the corresponding ground layer as much as possible, and the power layer satisfies the 20H rule.

3. Each wiring layer has a complete reference plane.

4, multi-layer board stacking, core material (CORE) symmetry, to prevent uneven distribution of copper skin density, asymmetry of the thickness of the medium to produce warp.

  5, the thickness of the plate does not exceed 4.5mm, for the thickness of the plate is greater than 2.5mm (backing plate is greater than 3mm) should have been confirmed by the craftsman PCB processing, assembly, equipment, PC card board thickness is 1.6mm.

  6. When the thickness-to-diameter ratio of the via is greater than 10:1, it is confirmed by the PCB manufacturer.

  7. The power supply and ground of the optical module are separated from other power sources and ground to reduce interference. 8. The power and ground handling of key components meet the requirements. 9 When there is impedance control requirement, the layer setting parameters meet the requirements.